Vaporization cutting

In vaporization cutting the focused beam heats the surface of the material to boiling point and generates a keyhole. The keyhole leads to a sudden increase in absorptivity quickly deepening the hole. As the hole deepens and the material boils, vapor generated erodes the molten walls blowing ejecta out and further enlarging the hole. Non melting material such as wood, carbon and thermoset plastics are usually cut by this method.
Melt and blow

Melt and blow or fusion cutting uses high-pressure gas to blow molten material from the cutting area, greatly decreasing the power requirement. First the material is heated to melting point then a gas jet blows the molten material out of the kerf avoiding the need to raise the temperature of the material any further. Materials cut with this process are usually metals.

Thermal stress cracking

Brittle materials are particularly sensitive to thermal fracture, a feature exploited in thermal stress cracking. A beam is focused on the surface causing localized heating and thermal expansion. This results in a crack that can then be guided by moving the beam. The crack can be moved in order of m/s. It is usually used in cutting of glass.
Stealth dicing of silicon wafers

Further information: Wafer dicing

The separation of microelectronic chips as prepared in semiconductor device fabrication from silicon wafers may be performed by the so-called stealth dicing process, which operates with a pulsed Nd:YAG laser, the wavelength of which (1064 nm) is well adopted to the electronic band gap of silicon (1.11 eV or 1117 nm).

Reactive cutting

Also called "burning stabilized laser gas cutting", "flame cutting". Reactive cutting is like oxygen torch cutting but with a laser beam as the ignition source. Mostly used for cutting carbon steel in thicknesses over 1 mm. This process can be used to cut very thick steel plates with relatively little laser power.